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FlashForge Circuits: Light-Based Printed Electronics on 3D Structures

FlashForge Circuits: Light-Based Printed Electronics on 3D Structures

FlashForge Circuits : Light-Based Printed Electronics on 3D Structures

Successful applicants will join VinUniversity as Master’s students /  Research Assistants at the College of Engineering and Computer Science (CECS), VinUniversity.

📍 Project Information 

As electronic systems are increasingly integrated into flexible and complex geometries, there is a growing need for fabrication methods that can directly create circuits on three-dimensional surfaces. However, conventional processes often require high temperatures and long processing times, limiting their compatibility with heat-sensitive materials and 3D-printed structures. 

The FlashForge Circuits project introduces a breakthrough approach to printed electronics by combining nanomaterial-based inks—such as metal nanoparticles, carbon nanotubes (CNTs), and graphene—with ultrafast light-based flash sintering. Instead of relying on traditional ovens, this method uses millisecond-scale light pulses to rapidly form highly conductive circuits. 

This approach enables fast circuit formation while keeping the substrate cool, making it possible to embed electronics directly onto heat-sensitive polymers and complex 3D-printed objects. 

Students will work at the intersection of materials science, electronics, and advanced manufacturing, including material development, circuit design, and system characterization. The technology opens new opportunities for smart structures, wearable electronics, robotics, and rapid prototyping. 

Principal Investigator: Prof. Simon Park 

 

📍 Research Objectives 

The project focuses on the following key objectives: 

(i) Develop printed electronics processes using nanomaterial-based inks and flash sintering 

(ii) Investigate and optimize the electrical properties of materials such as metal nanoparticles, CNTs, and graphene 

(iii) Design and fabricate electronic circuits on flat and complex 3D surfaces 

(iv) Evaluate performance and reliability of printed electronic systems 

(v) Extend applications to flexible electronics, wearable devices, and intelligent robotic systems 

Through these efforts, the project aims to advance next-generation electronic manufacturing technologies with seamless integration of materials, structures, and functionalities. 

 

📍 Project Contact 

 For further information about the project, please contact Prof. Simon Park via email [email protected] 

 

Graduate Admissions Contact 

Apply now: https://apply.vinuni.edu.vn/graduate/s/login/ 

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